Materials | Line Width and Space | Drilling | Routing | Scoring | Edge Beveling |
Quality | Multilayer Lamination | Soldermask | Legend | Hole Plugging and Cu Plating |
Surface Finishes | Controlled Impedance | Electrical Test | UL Requirements | Heat Sink Bonding | Metal Carrier Finishes (Aliminum) | Metal Carrier Finishes (Copper)

    Standard Special
UL requirements Materials approved FR-4 (Tg=135°C min.), FR-4 (Tg=170°C min.), Getek ML200+, TLY-(a) (94V-0 only), Diclad 880 (94V-0 only)  
  Soldermask approved Taiyo PSR-400BN Semi-gloss, SR1020  
  Surface finishes available HASL, Fused/Unfused Tin-Lead, Electrolytic/Immersion Tin, Elytic/Eless Nickel- Elytic/Eless/Immersion Gold, OSP Entek 106A, Bare Copper  
  Max. internal Copper foil 2 oz.  
  Min. external Copper foil 0.5 oz.  
  Min. line width 0.004"  
  Max. area diameter 2.0"  
  Min. edge width 0.010"  
  Copper thickness for double sided 1/2 oz. to 3 oz.