Materials
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Line Width and Space
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Drilling
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Routing
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Scoring
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Edge Beveling
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Quality
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Multilayer Lamination
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Soldermask
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Legend
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Hole Plugging and Cu Plating
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Surface Finishes
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Controlled Impedance
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Electrical Test
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UL Requirements
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Heat Sink Bonding
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Metal Carrier Finishes (Aliminum)
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Metal Carrier Finishes (Copper)
Standard
Special
UL requirements
Materials approved
FR-4 (Tg=135°C min.), FR-4 (Tg=170°C min.), Getek ML200+, TLY-(a) (94V-0 only), Diclad 880 (94V-0 only)
Soldermask approved
Taiyo PSR-400BN Semi-gloss, SR1020
Surface finishes available
HASL, Fused/Unfused Tin-Lead, Electrolytic/Immersion Tin, Elytic/Eless Nickel- Elytic/Eless/Immersion Gold, OSP Entek 106A, Bare Copper
Max. internal Copper foil
2 oz.
Min. external Copper foil
0.5 oz.
Min. line width
0.004"
Max. area diameter
2.0"
Min. edge width
0.010"
Copper thickness for double sided
1/2 oz. to 3 oz.