Materials | Line Width and Space | Drilling | Routing | Scoring | Edge Beveling |
Quality | Multilayer Lamination | Soldermask | Legend | Hole Plugging and Cu Plating |
Surface Finishes | Controlled Impedance | Electrical Test | UL Requirements |
Heat Sink Bonding | Metal Carrier Finishes (Aliminum) | Metal Carrier Finishes (Copper)
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Standard |
Special |
| Metal carrier finishes over aluminum |
Electroless Ni(per MIL-C-26074E,Class 1,Grade A) Copper flash Electrolytic Silver(per QQ-S-365D,Type 1,Grade B) |
100-300 µ in Ni 10 µ in nominal Copper 200 µ in min. Silver |
Ni-Range specified Silver-Range specified |
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Electroless Ni(per MIL-C-26074E,Class 1,Grade A) Copper flash Electrolytic Matt Tin |
100-300 µ in Ni 10 µ in nominal Copper 200 µ in min. Tin |
Ni-Range specified Tin-Range specified |
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Electroless Ni(per MIL-C-26074E,Class 1,Grade A) Copper flash Electrolytic Ni(per MIL-S-QQN-290A,Class I,SD) Electrolytic Soft Au(per MIL-G-45204C,Type III,Grade A) |
50-100 µ in Ni 10 µ in nominal Copper 100-300 µ in Ni 3 µ in min. Au |
Ni-Range specified Gold-Range specified |
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Electroless Ni(per MIL-C-26074E,Class 1,Grade A) Copper flash Electrolytic Ni(per MIL-S-QQN-290A,Class I,SD) Electrolytic Hard Au(per MIL-G-45204C,Type II,Grade C) |
50-100 µ in Ni 10 µ in nominal Copper 100-300 µ in Ni 3 µ in min. Au |
Ni-Range specified Gold-Range specified |
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Chromate conversion coatin(per MIL-C-5541E,Class 3) |
Coverage |
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