Materials | Line Width and Space | Drilling | Routing | Scoring | Edge Beveling | Quality | Multilayer Lamination | Soldermask | Legend | Hole Plugging and Cu Plating | Surface Finishes | Controlled Impedance | Electrical Test | UL Requirements | Heat Sink Bonding | Metal Carrier Finishes (Aliminum) | Metal Carrier Finishes (Copper)     Standard Special Metal carrier finishes over copper Copper flash Electrolytic Silver(per QQ-S-365D,Type I,Grade B) 10 µ in nominal Copper 75-150 µ in Silver     Copper flash Electrolytic Matt Tin 10 µ in nominal Copper 75-150 µ in Tin     Electroless Ni(per MIL-C-26074E,Class 1,Grade A) 100-300 µ in Ni Ni-Range Specified   Electroless Ni(per MIL-C-26074E,Class 1,Grade A) Electrolytic Soft Au(per MIL-G-45204C,Type III,Grade A) 100-300 µ in Ni 10 µ in nominal Copper 3 µ in min. Au Ni-Range Specified Au-Range specified   Electroless Ni(per MIL-C-26074E,Class 1,Grade A) Electrolytic Hard Au(per MIL-G-45204C,Type II,Grade C) 100-300 µ in Ni 10 µ in nominal Copper 3 µ in min. Au Ni-Range Specified Au-Range specified   Electroless Ni(per MIL-C-26074E,Class 1,Grade A) Immersion Au 100-300 µ in Ni 3-8 µ in Au Ni-Range Specified   Electroless Ni(per MIL-C-26074E,Class 1,Grade A) Electroless Au 100-300 µ in Ni 30 µ in min. Au Ni-Range Specified Au-Range specified