Materials | Line Width and Space | Drilling | Routing | Scoring | Edge Beveling | Quality | Multilayer Lamination | Soldermask | Legend | Hole Plugging and Cu Plating | Surface Finishes | Controlled Impedance | Electrical Test | UL Requirements | Heat Sink Bonding | Metal Carrier Finishes (Aliminum) | Metal Carrier Finishes (Copper)     Standard Premium Heat sink bonding Bonding processes Flexlink, Sweat solder     Flexlink materials Flexlink II Flexlink I, Ablestick   Sweat solder pastes 95% Tin 5% Antimony 95% Tin 5% Silver, 10% Tin 90% Lead, 10% Tin 88% Lead 2% Silver   Board to carrier registration Aluminum 6061 T-6 Copper Osprey (27% Silicon composite), 380 Aluminum