Lamination | MetalBack | Quality | Other services
| Standard | Premium | ||
| Heat sink bonding | Bonding processes | Flexlink, Sweat solder | |
| Flexlink materials | Flexlink II | Flexlink I, Ablestick | |
| Sweat solder pastes | 95% Tin 5% Antimony | 95% Tin 5% Silver, 10% Tin 90% Lead, 10% Tin 88% Lead 2% Silver | |
| Board to carrier registration | Aluminum 6061 T-6 Copper | Osprey (27% Silicon composite), 380 Aluminum |
