Materials | Line Width and Space | Drilling | Routing | Scoring | Edge Beveling | Quality | Multilayer Lamination | Soldermask | Legend | Hole Plugging and Cu Plating | Surface Finishes | Controlled Impedance | Electrical Test | UL Requirements | Heat Sink Bonding | Metal Carrier Finishes (Aliminum) | Metal Carrier Finishes (Copper)     Standard Special Multilayer Lamination Technique Hi-Temp Vacuum Assisted Hydraulic Press     Layer-to-layer registration +/- 0.005"     Bonding Media FR-4 (Tg=135°C) Prepreg, FR-4 (Tg=170°:C) Prepreg Getek, Thermosets and Thermoplastice   Thickness control +/- 10% +/- 8%