Lamination | MetalBack | Quality | Other services
| Standard | Premium | ||
| Plating | Etching tolerance (1 oz copper) | +/- 0.001” | +/- 0.0005” |
| Etching | Etching tolerance (1/2 oz copper) | +/- 0.007” | +/- 0.0004” |
| Wet Processing | Min Line/Gap | 0.005” | Consult factory |
| PTH aspect ratio, Max. | 5:01 | 10:01 | |
| Copper Plating Thickness, Min | 0.001” | Consult factory | |
| Tin/Lead Plating Thickness MIL-P-81728A | 0.003” | Consult factory | |
| Solder Composition | 63% tin, 37% lead | ||
| Tensile strength, plaed copper | 45K PSI | ||
| Elongation, plated copper | 20%, typical 24% | ||
| Immersion tin | Hot tin, 20-70µ | ||
| Nickel plating, electrolytic | QQ-N-290 | ||
| Gold plating, Immersion | 3-12 µ | ||
| Gold plating, Electrolytic | MIL-G-45204, Type III, Grade A | ||
| Fused Tin/Lead capabilities | Hot oil reflow, HASL, infrared | ||
| Selective solder strip | Min. dam width 0.010” | ||
| Bright tin plating | MIL-T-10727C, Type I (ED) | ||
| Electroless nickel | MIL-C-26074E | ||
| Electroless nickel/Immersion Gold | MacDermid Planar | ||
| Subcontracted plating treatments | Gold type II, Silver (electrolytic) |
