Materials | Line Width and Space | Drilling | Routing | Scoring | Edge Beveling | Quality | Multilayer Lamination | Soldermask | Legend | Hole Plugging and Cu Plating | Surface Finishes | Controlled Impedance | Electrical Test | UL Requirements | Heat Sink Bonding | Metal Carrier Finishes (Aliminum) | Metal Carrier Finishes (Copper)     Standard Special Hole Plugging Conductive Silver ink - DuPont CB-100 Yes Max. hole size 0.018", A.R.= 6:1     Non-conductive Epoxy hole plugging ink Yes Max. nole size 0.018", A.R.= 6:1   Copper Plating Min. plating in hole 0.001" 0.002"