Materials | Line Width and Space | Drilling | Routing | Scoring | Edge Beveling | Quality | Multilayer Lamination | Soldermask | Legend | Hole Plugging and Cu Plating | Surface Finishes | Controlled Impedance | Electrical Test | UL Requirements | Heat Sink Bonding | Metal Carrier Finishes (Aliminum) | Metal Carrier Finishes (Copper)     Standard Special Surface Finishes Hot Air Solder Level (Preferred) Composition 60% Sn - 40% Pb Coverage 60-1500 µ in.   OSP Entek 106A Solderable     Electroless Ni (per MIL-C-26074E, Class 1, Grade A) Immersion Au 100 - 300 µ in Nickel 30 µ in max. Gold 40+ µ in Gold   Electroless Ni (per MIL-S-QQN-290A, Class 1, SD) Electrolytic Soft Au (per MIL-G-45024C, Type III, Grade A) 100 - 300 µ in Nickel 50 µ in max. Gold     Electroless Ni (per MIL-S-QQN-290A, Class 1, SD) Electrolytic Soft Au (per MIL-G-45024C, Type II, Grade A) 100 - 300 µ in Nickel 50 µ in max. Gold     Immersion Silver 2 - 40 µ in. min.     Immersion Tin 2 - 40 µ in. min.     Electrolytic Matte Tin 300 µ in. min Specified Range   Electrolyitc Tin-Lead (Unfused) Composition 60% Sn - 40% Pb 300 µ in. min Specified Range   I.R. Reflow (Fused Tin-Lead) Composition 60% Sn - 40% Pb 300 µ in. min. Specified Range